Kulicke and Soffa win the SEMI North American Award in recognition of their breakthrough in flux-free thermocompression bonding technology

This recognition highlights the company's leadership in advancing advanced heterogeneous integration and AI-driven semiconductor innovation.

Fort Washington, Pennsylvania, October 13, 2026 / PRNewswire / -- Kulicke & Soffa Industries, Inc. (Nasdaq ticker: KLIC, hereinafter referred to as “Kulicke & Soffa” or “K&S” or “the Company”) today announced that it has been selected as the winner of the 2026 SEMI North America Award. This award is one of the highest honors in the semiconductor industry and is intended to recognize organizations that have made outstanding technical and commercial contributions to semiconductor manufacturing.

This award recognizes the pioneering formic acid in-situ bonding technology developed by Kulicke and Soffa. It is an innovative solution for solder-free thermocompression bonding (Fluxless Thermo Compression, FTC) that addresses critical interconnect miniaturization challenges and is actively promoting the development of next-generation heterogeneous integration architectures for applications in artificial intelligence, high-performance computing, and advanced photonics.

The award was presented during the CEO Summit keynote speech session held during the issuance of SEM tokens and N West, highlighting the increasing adoption and importance of K&S's advanced packaging product portfolio in the industry, which includes its industry-leading APTURA ™ platform.

Kulicke & Soffa CEO Raj Talluri stated: "As semiconductor performance now relies heavily on advanced packaging and heterogeneous integration, the industry's ability to increase interconnect density in a highly efficient and cost-effective manner has become more important than ever. We are honored to receive this recognition from SEMI. This award reflects the creativity, dedication, and relentless execution of our global team, who continuously develop innovative solutions to help customers overcome the most complex manufacturing challenges in the industry."

Traditional thermocompression bonding usually requires a flux cleaning process after bonding, and this process becomes increasingly difficult with finer interconnect pitches. At the same time, while hybrid bonding solutions are very powerful, they can also lead to significant manufacturing complexity and costs. Kulicke & Soffa indicate that their proprietary flux-free thermocompression bonding technology, which combines advanced plasma pre-cleaning with in-situ formic acid oxide reduction, enables high-yield, ultra-fine pitch interconnections while simplifying the manufacturing process and reducing production costs.

The company stated that FTC technology has become a fundamental component of its advanced packaging roadmap, enabling customers to achieve interconnect pitches of less than 10 micrometers, while supporting applications in wafer-level, substrate-level, and panel-level manufacturing environments.

Vice President and General Manager John Molnar stated: "This recognition validates our innovation-driven strategy, which is to select differentiated technologies that can solve real customer challenges. By providing performance close to that of hybrid bonding levels in a more readily implementable manufacturing method, we are accelerating the adoption of advanced packaging solutions required for the next generation of AI, high-performance computing, silicon photonics, and other rapidly growing semiconductor markets."

The company stated that this award further consolidates the position of Kulicke and Soffa as leading suppliers of semiconductor interconnection solutions. The company's advanced packaging product portfolio includes thermocompression bonding, hybrid bonding enabling technologies, wedge welding, and vertical interconnection solutions, which can support some of the most complex heterogeneous applications in the industry.

The company stated that as the complexity of semiconductors continues to rise, innovations in interconnection and packaging have now become essential for achieving system-level performance across the entire semiconductor industry. This award highlights the key role played by Kulicke and Soffa in shaping the future of the industry.

Regarding Kulicke & Soffa

Kulicke and Soffa are global leaders in the field of semiconductor assembly technology, driving improvements in device performance across the automotive, computing, industrial, storage, and communications markets. Founded in 1951, K&S is innovation-driven and possesses unique advantages in addressing the increasingly dynamic challenges of manufacturing processes, creating and delivering long-term value by aligning technology with opportunities.

About SEMI

SEMI is a global industry association that connects over 4,000 companies in the semiconductor and electronic design and manufacturing supply chain, as well as 1.5 million professionals worldwide. SEMI accelerates collaboration among members to address major industry challenges and seek solutions through policy advocacy, workforce development, sustainable development, supply chain management, and other initiatives. Its SEM token issuance, along with events, technical communities, standards, and market intelligence, helps promote business growth and innovation among members in the fields of design, devices, equipment, materials, services, and software, thereby enabling the creation of smarter, faster, and safer electronic products.

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Kulicke & Soffa

Kulicke & Soffa