NVIDIA announces cooperation with Amkor, IBIDEN, Kyungwon Electronics, Samsung Electro-Mechanics, Siltron Precision Industries (SPIL), and Hynix Semiconductor, among other supply chain partners, to expand production capacity in substrates, advanced packaging, chip testing, and optical engines in order to meet the growing infrastructure demands of AI.
NVIDIA plans to increase the production capacity of the substrates for related products by 2.5 times over the next three years.
In terms of advanced packaging, Amkor plans to increase the production capacity of intermediary layer wafers by more than 300% by the end of 2028.
In terms of chip testing, NVIDIA expects its total testing capacity to double by 2027 compared to 2026. It has also made a prepayment of $1.1 billion to Kyungwon Electronics to support the construction of new testing facilities in the United States, with the goal of starting large-scale mass production in April 2027.
In terms of optical interconnection, NVIDIA and Siliconware plan to increase the production capacity of optical engines used for co-packaged optics ( CPO ) to 15 times the current level by mid-2027, and aim to double it again by the end of 2028.
In terms of substrate suppliers, Samsung Electro-Mechanics will join NVIDIA's supply chain, while Hynix Electronics is expected to gradually increase its production capacity starting from the second quarter of 2027. The related expansion projects are anticipated to reach full production by the middle of 2028.
