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Micron Announces G11 NAND: Over 400 Layers of Stacking, Double Density, Capacity Increase in the Second Half of 2027
The Block
1h ago
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Micron outlined its vision for DRAM, HBM, NAND, and SSD at the 2026 Annual Technology Symposium, revealing that production capacity for G11 NAND is expected to begin to ramp up in the second half of 2027. This generation of products features over 400 layers stacked on top of each other, utilizing wafer-on-wafer bonding technology. The storage density, calculated by area, is approximately twice that of the current 276-layer G9 NAND. The I/O speed can be increased by up to 1.5 times, and data transmission energy consumption can be reduced by more than 25%.
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News from the IT Home on October 22nd: Micron (Micron) held its annual technology webinar yesterday local time, where they looked ahead to DRAM, pan-HBM, NAND, and SSD. This article focuses on the flash memory category.

Micron has previewed its G11 NAND flash memory, which is expected to see an increase in production capacity in the second half of 2027. It seems that this company has skipped the G10 generation.

G11 NAND With over 400 layers stacked, wafer-to-wafer bonding technology is used, resulting in a storage density that is approximately twice that of the current 276-layer G9 NAND. At the same time, it can achieve up to 1.5 times the I/O rate, and data transmission energy consumption can be reduced by more than 25%.

After G11, Micron plans to introduce breakthrough high-migration-rate materials in NAND to achieve an ultra-dense cell architecture and enhance energy-saving properties.

Micron introduced two types of AI-class data center-level NAND designs, which are respectively GPU direct connection IOPS optimization products based on SLC, and bandwidth optimization products similar to those defined by HBF.

Micron also showcased its comprehensive AI optimized storage solutions.

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