According to CoinMeta, Morgan Stanley: Intel’s advanced packaging mainly targets AWS Trainium3, the next generation of Trainium4, as well as its own-developed servers CPU. The Morgan Stanley research report provides an in-depth analysis of Intel’s advanced packaging roadmap, focusing on two generations of embedded multi-chip interconnect bridge technologies: EMIB-M and EMIB-T, which are designed for high-performance AI accelerator scenarios. Analysts indicate that the main customers for EMIB-M will be AWS’s Trainium3 accelerators, the upcoming Trainium4 chips, and Amazon’s self-developed servers CPU. Morgan Stanley considers AWS to be the primary expected customer for EMIB-M and EMIB-T, and other large-scale cloud providers are also evaluating this packaging solution. Google has already validated EMIB-T for the next generation of TPUv9, further driving the development of Intel’s advanced packaging business.