Creative Electronics Launches TSMC’s N2P Process HBM4E IP, Supporting 16Gbps Speed
Ai Focus
Chip design services and IP Enterprise Creative Electronics ( GUC ) announced that their HBM4E physical layer and controller, which utilize TSMC's 2nm manufacturing process N2P, have completed the design phase and have been adopted by a client AI ASIC. This IP supports a data transmission rate of 16Gbps, is designed for CoWoS-S /R/L advanced packaging, and also provides a face-up version suitable for TSMC SoIC -X technology.
On September 29th, according to IT, news from the chip design service and IP Enterprise Creative Electronics ( GUC ) stated that they have finalized the design for the N2P using TSMC's 2nm manufacturing process for both the HBM4E physical layer and the controller ( Controller ), which has been adopted by the customer AI ASIC.
Creative Electronics' HBM4E IP supports a data transfer rate of 16Gbps and offers industry-leading power consumption and area performance. It is optimized for signal integrity and power integrity, and supports CoWoS-S /R/L advanced packaging.
To support the 3D SoIC architecture, Creative Electronics also provides a face-up version specifically designed for TSMC SoIC-X technology. This variant integrates the TSV (silicon through-hole) structure, which is used for vertical signal and power transmission, establishing a complete connection path for complex 3D integration architectures.
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