Foxconn's ecosystem drives the construction of the AI "token factory," becoming the focus of Hon Hai Technology's plans for 2026
The Foxconn ecosystem is driving the construction of the AI "Token Factory," setting it to become the star of Hon Hai Technology Day in 2026.
This representative annual technology conference has been held for the seventh consecutive year to celebrate technological partnerships.
A record-breaking 321 exhibits showcased vertical integration and precision manufacturing capabilities.
A 20-meter-long display wall showcases the components required for the integration of the next generation of AI infrastructure systems.
- HHTD26 brings together the largest-scale demonstrations of embodied intelligence.
Taipei, October 30, 2026 / PRNewswire / -- Hon Hai Precision Industry Co., Ltd. (Foxconn) ( TWSE : 2317) stated on Friday that, as the world's largest electronics manufacturer and AI server supplier, the company confirmed its industry-leading position in the "token factory" solution field by unprecedentedly showcasing system components and technologies that support the next generation of AI infrastructure, and for the first time highlighted its long-term partnerships.
At the 7th Hon Hai Technology Day 2026 ( HHTD26 ), Foxconn demonstrated its strong vertical integration capabilities and globally leading precision manufacturing skills. The company stated that these capabilities support its work on the NVIDIA Vera Rubin platform, covering various aspects ranging from rack-level AI supercomputing system integration to sub-micron level component manufacturing technology.
Foxconn highlighted two new exhibits this time: The first is NVIDIA DSX POD, which is a standardized, factory-prebuilt reference design that enables partners to pre-integrate rack-level AI infrastructure based on NVIDIA Vera Rubin into modular containers. Critical verifications can be completed before shipment, and after delivery, the equipment can be connected to the prepared on-site infrastructure. The company stated that this exhibit became a focal point of the event and welcomed visitors at the entrance. The second is a dedicated customer exhibition area that pays tribute to those cooperative relationships that have driven industry development behind the scenes through photos from key moments and a timeline of technical milestones.
"Foxconn is transforming into a technology manufacturing platform service provider," said Terry Gou, Chairman of Foxconn. "From testing to deployment, our vertical integration and precision manufacturing make the impossible possible. We are developing this advantage into an ecosystem that covers smart consumer electronics, AI, electric vehicles, as well as space and robotics industries."
Of the HHTD26 record-breaking 321 exhibits, a quarter came from the "Token Factory" exhibition area. Extreme collaborative design was presented through a visual route: a 20-meter-long display wall showcased printed circuit boards integrated with tens of thousands of micron-level precision engineering components; it also included cable-free, hose-free, fan-free computing tray designs for single AI servers; a major trend of AI – co-packaged optics ( CPO ); as well as power supply, cooling, and high-speed data solutions redesigned for more efficient AI infrastructure.
An immersive simulation of a AI data center demonstrates how AI computing, networking, power supply, and cooling are co-designed to build a AI factory, which includes an 800VDC power distribution scheme. Foxconn's business departments focused on AI supercomputing and cloud operations, as well as its NVIDIA cloud partners Visionbay.ai, are planning to design their facilities according to the NVIDIA DSX MaxLPS principles in order to maximize the performance per watt of the AI factory within a fixed power envelope, and to optimize the computing, power supply, and cooling configurations before construction.
On the main stage, NVIDIA, Google LLC, and Schneider Electric discussed infrastructure centered around AI; Honda R&D Co., Ltd. (Honda R & D Co Ltd) and Mitsubishi Electric Mobility (Mitsubishi Electric Mobility) discussed the next generation of electric mobility. The largest demonstration of embodied intelligence by HHTD26 was focused in the area showcasing humanoid robots, demonstrating the expanding potential of the ecosystem as well as real-world application cases of industrial products in the robotics field.
Foxconn also showcased for the first time its expertise in ultra-precision manufacturing processes. The company stated that these capabilities are supported by its proprietary machinery for machining, material processing, and mold manufacturing. The precision manufacturing exhibition area displayed a number of technological achievements, including the Poketomo AI companion robot and durable laptop protective cases.
In all the exhibits, the importance of AI security was also a main theme. The Foxconn team demonstrated how the NVIDIA open proxy security platform supports proxy security in intelligent healthcare, intelligent manufacturing, intelligent robots, and smart cities.
HHTD26 will be held on October 30th and 31st at the 1st and 4th floors of Hall 1 of the Nangang Exhibition Center in Taipei. For the first time this year, a family exhibition area has been set up during this two-day annual conference, allowing children to engage with themes such as sustainable development, mobility, smart factories, and smart cities through hands-on exploration activities.
For more information about 2026 Hon Hai Technology Day, please visit the relevant page.
For more information about Foxconn, please refer to the company's profile.
