Shanghai, November 5th / PRNewswire / -- Ceva , Inc . (Nasdaq ticker: CEVA), a licensor of silicon intellectual property and software intellectual property in the field of intelligent edge, announced today that NSING Technologies, a provider of microcontrollers and semiconductor solutions, has shipped over 250 million Bluetooth chips equipped with Ceva - Waves Bluetooth Low Energy ( LE ) IP. This milestone highlights the results of their long-term collaboration, as well as the widespread adoption of NSING Technologies's Bluetooth products in wearable devices, consumer electronics, smart homes, automotive, and industrial applications.
NSING Technologies has always built its Bluetooth product portfolio based on Ceva - Waves Bluetooth LE IP, combining Ceva's mature connection technology with its own low-power radio frequency design and MCU architecture. Ceva indicates that this approach has helped NSING Technologies to develop a wide range of Bluetooth solutions with high integration and better energy efficiency, while also accelerating product development and maintaining stable performance and standard compliance across multiple generations of products.
The cooperation between the two parties covers multiple generations of Bluetooth products from NSING Technologies, including the N32WB452 series dual-core Bluetooth, LE MCU, as well as the N32WB03x series ultra-low power consumption Bluetooth LE SoC. These solutions support a variety of applications, such as electronic toll collection systems, wireless remote controls, smart lighting, electric bicycle anti-theft systems, indoor positioning, and industrial wireless connections.
Vice President Xinhui Mu stated: "The shipment volume of Bluetooth chips has reached 250 million units, which reflects the strength of our product portfolio as well as the trust our customers have in our technology. Ceva has always been a valuable technical partner throughout our growth process, and we look forward to continuing to build on this success as we expand into new markets and applications."
Ceva, the Executive Vice President of Connectivity and Sensing Division, said to Ziv Hammer: "The shipment volume of NSING Technologies Bluetooth chips reflects the vast coverage of wireless connections, as well as the role played by Ceva in this process. Ceva drivers have been deployed in billions of devices worldwide. Such a milestone indicates how our IP licensing model can be transformed into sustained mass production and long-term royalty opportunities."
Ceva The complete Ceva-Waves wireless connection IP combination includes Bluetooth LE, Bluetooth Dual Mode, Bluetooth High Data Throughput (HDT), Wi-Fi, and ultra-wideband (UWB), and is equipped with integrated hardware and software solutions. These technologies support the “Connect” pillar of the Ceva strategy, helping devices to achieve connection, perception, and reasoning, which is part of the broader industry transformation towards Physical AI. Ceva's wireless connection IP has been licensed by global leading semiconductor companies and is deployed in billions of devices. For more information about the Ceva Bluetooth platform, please visit: https:// www.ceva-ip.com / product / ceva-waves-bluetooth /.
About NSING
NSING TECHNOLOGIES INC. ( NSING ) is a leading enterprise in MCU and security chips, adopting a dual-headquarters system with Shenzhen as the domestic headquarters and Singapore as the international headquarters. The company has a leading edge in security, SoC, radio frequency, and power technology. With AI computing infrastructure, embodied AI, and edge-side AI as its core strategic directions, it provides global customers with consumer-grade, industrial-grade, and automotive-grade IC, as well as complete system solutions. Its products support a variety of application scenarios, including embodied robots, AI computing infrastructure, industrial control, automotive electronics, consumer electronics, and medical care.
For more information, please visit: https :// nsing.com.sg. Follow us on LinkedIn.
Regarding Ceva, Inc.
Ceva is committed to empowering the intelligent edge, connecting the digital world with the physical world, and facilitating the implementation of AI driven products. Its combination of Ceva AI fabric silicon and software IP endows devices with connectivity, perception, and reasoning capabilities, which are the core strengths of the intelligent edge. From 5G, cellular IoT, Bluetooth, Wi-Fi, and UWB connectivity, to scalable edge AI NPU, AI DSP, sensor fusion processors, and embedded software, Ceva provides the foundational IP for devices, enabling them to connect, understand their environment, and act in real-time.
Ceva has shipped over 22 billion devices and has more than 400 customers worldwide. It is the foundation for today's most advanced intelligent edge products – ranging from AI enhanced wearable devices and IoT devices to autonomous vehicles and 5G infrastructure. Its differentiated solutions can be seamlessly integrated into existing design processes, offering a highly flexible range of options, ultra-low power consumption, and extremely small chip areas, helping customers to accelerate development, reduce risks, and bring innovative products to market more quickly. As technology evolves towards Physical AI, Ceva's IP combinations lay the groundwork for systems that are always online, environmentally aware, and capable of making intelligent decisions in real-time.
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