Munich, November 13, 2026 / PRNewswire / -- LITEON Technology (2301) showcased its technical capabilities across multiple product lines at the electronica exhibition in Munich, Germany in 2026. The exhibition took place from November 10th to 13th. With the theme of “LITEON Powers AI”, LITEON demonstrated a range of technologies, from power supply and connection technologies for AI data centers to AI at the edge, promoting the development of intelligent applications from the cloud to the edge.
As the computing power of AI continues to grow and its power density continues to increase, LITEON has presented a complete set of AI power supply solution combinations that support the NVIDIA MGX and OCP Open Rack V3 (ORV3) architectures, covering rack-level power supply, backup power supply, as well as power conversion near the chips.
In terms of rack-level power supply, LITEON showcased a 110-kilowatt power supply rack that supports the NVIDIA Vera Rubin NVL72 architecture, featuring active power distribution and input current smoothing capabilities to enhance power supply stability under dynamic AI workloads; it also presented a 72-kilowatt power supply rack that combines high output power with a space-saving 1U design.
LITEON also demonstrated the 800VDC power supply architecture of NVIDIA through an interactive virtual rack, with configurations including 330 kilowatts, 880 kilowatts, and 1.2 megawatts, to illustrate the evolution of high-power density racks towards megawatt-level AI infrastructure.
LITEON also demonstrated its high-performance capacitor backup units (CBU), which enhance power supply resilience by providing reserve energy; at the same time, it showcased power supply technologies close to the chip, including intermediate bus converters (IBC), voltage regulation modules (VRM), and high-efficiency power modules (Power Bricks), in order to reduce conversion losses and support high-power density (AI) computing.
LITEON is expanding AI applications from the cloud to the edge, and showcasing power supply, networking, 5G, and edge AI visual solutions for enterprise and industrial scenarios. Its power product portfolio includes 800-watt and 2,000-watt general-purpose redundant power supplies ( CRPS ), high-power PoE injectors, 12-watt to 960-watt DIN rail power supplies, industrial-grade AC / DC and DC / DC power supplies, as well as medical power supply solutions suitable for a variety of edge applications.
In terms of connectivity technology, the Connected AI Edge ecosystem of LITEON includes O-RAN radio units that support FR1 and FR2 frequency bands, as well as AI-RAN solutions that combine AI computing with 5G connectivity based on the NVIDIA AI Aerial platform. LITEON indicates that after integrating U-MEDIA, the company also showcased its fixed wireless access ( FWA ) solutions, as well as integrated small base stations, Ethernet switches, and Wi – Fi access points.
In terms of intelligent edge applications, LITEON demonstrated security cameras driven by AI and AI Box, which possess local AI inference capabilities, enabling real-time analysis and decision-making in fields such as smart buildings, healthcare, retail, and industrial automation. LITEON indicates that these technologies collectively showcase the company's capabilities in power supply, connectivity, and intelligent computing, supporting AI infrastructure ranging from high-power density data centers to intelligent edge applications.
