SpaceX is developing a AI chip rack to reduce dependence on NVIDIA-compatible components
The Block
1h ago
Ai Focus
According to SemiAnalysis, SpaceX is developing Kessel, which is a customized version of the Vera Rubin NVL72 rack. It replaces the original NVLink cable boxes with passive PCB midboards. This solution retains 72 GPU enclosures, 18 computing trays, and 9 switching trays, but it changes the arrangement of the trays and the procurement method. SpaceX plans to purchase chip enclosures directly from NVIDIA, while the rest of the components will be purchased separately.
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According to SemiAnalysis, SpaceX is developing Kessel, which is a customized version of the Vera Rubin NVL72 rack. It replaces the original NVLink cable boxes with passive PCB midboards.

This scheme retains the 72 GPU enclosures, 18 computing trays, and 9 exchange trays of Oberon, but these trays are arranged back to back around the central board.

It can be understood as a mini version of Kyber. It has a smaller vertical expansion range, and its design is suitable for both ground deployment and orbital deployment. The question is whether this scaled-down version can make the mid-size solution feasible.

There is a significant difference in manufacturing difficulty between the two: Kessel uses 84 layers of M10 middle plates, while the earlier Kyber scheme planned to use 156 layers of M9 middle plates. With fewer layers, the manufacturing feasibility is higher, but this design requires the use of higher-grade materials.

Kessel At the same time, there will be a change in the component procurement model: SpaceX plans to directly purchase chip packaging from NVIDIA, while other components will be procured independently, bypassing NVIDIA L6 the circuit boards.

This will give SpaceX greater autonomy in supplier selection and component procurement.

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